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东莞市华源电子材料有限公司
1. 产品名称：
SMT贴片红胶HY-900
2. 产品说明：
HY-900贴片红胶，是单组份的环氧树脂胶粘剂。其高速长时间印刷仍可保持不拉丝、不溢胶、不塌陷的稳定形狀，其“剪切稀化＂粘度特性和低吸湿性，非常适合应用于常温厚网(铜网或胶网)印刷的 SMT工艺，胶点形狀非常容易控制，储存安定性好且具有优良的耐热冲击性和优良的电气特性，同时使用安全，不含溶剂，无气味，完全符合环保要求。
3. HY-900贴片红胶特性（ Specification of HY-900）
|
成 份 Composition |
环氧树脂： Epoxy resin |
|
外 观 Appearance |
红色糊状： Paste/red-colored |
|
比 重 Specific gravity |
1.31 |
|
粘 度 Viscosity at 25℃,5rpm |
350Pa·S |
|
摇变性指数 Thixotropy index |
6.8(1rpm/10rpm) |
|
接着强度Adhesive Strength 2125C Mini-mold tr SOP·IC16P 1206 0805 0603 0402 |
44N(4.5kgf)0.2mgr twin 45N(4.6kgf)0.3mgr twin 92N(9.4kgf)0.8mgf single×2 |
|
电气特性 Electric Property 体积阻抗系数 Volume resistance 绝缘阻 Insulation resistance 初期值 Initial value 处理后* After treating* 介电常数 Dielectric constant 介电正接 Dielectric loss tangent |
3.6×1016Ω·cm JIS K6911 1.2×1014Ω JIS Z3197 1.2×1012Ω 3.12/1MHZ JIS K6911 0.012/1MHZ JIS K6911 |
|
保存条件 Preservation condition |
To be strictly kept at less than |
* 处理条件：
*Treating condition:
*JIS Z3197 Measured at comb electrode model II (G10)
4.包装方式 （Package styles）
|
包装方式 Package styles |
容量 Contents |
包装单位 Pack.Unit |
点胶机设备厂商 Applicable Dispenser Makers |
|
1．条装 Tube |
200gr |
10Pcs. |
For all |
|
2．圆柱筒 |
300ml |
5Pcs. |
For all |
|
3．圆柱筒 |
350gr |
12Pcs |
For all |
|
4．罐装 PLASTIC JAR |
360gr |
12Pcs |
For all |
|
5．罐装 PLASTIC JAR |
500gr |
10Pcs |
For all |
5.特征（Features ）
|
1. Much lower temperature curing is aimed at amd is practically possible. 2. Very good stable curing shapes without stringing and slumping are achieved at super high speed dispensing and very amall dots. 3. stable adhesive strength can be obtained with a variety of SMD. 4. Long-term preservation stability is expected. 5. High heat-resistivity and excellent electric properties are possessed. 6. Usable for screen printing. |
1． 容许低温度硬化。 2． 尽管超高速涂敷、微少量涂敷仍可保持没有拉丝，塌陷的稳定形状。 3． 对於各种表面粘着零件，可获得安定的接着强度。 4． 储存安定性优良。 5． 具有高度耐热性和优良的电气特性。 6． 可用於网版印刷。 |
6.固化条件（Curing condition）
|
○Recommended curing condition:Over 60 sec after PCB’s surface temperature has reached ○When the higher curing temperature and the longer curing time,the stronger adhesive strength can obtained.We would suggest you to search out an optimum curing condition,for the temperature exerterd on the adhesive may occasionally vary according to the size,material,etc.of component parts mounted on PCBs. |
固化条件 ○建议固化条件是PCB板表面温度达到 ○固化时间越长，可获得更高的粘接强度，依PCB板上装着元件材质、大小不同而实际附加于接着剂的温度会有所不同，因此请依据实际生产情况找出最适合的固化条件。 |
